For Consumer / IoT
Lead package comes in a variety of forms such as a gull-wing type and a flat lead type, depending on a lead shape.
Having leads enables to easily check a status of solder joining when mounting on board. Lead package is high in mounting reliability due to its resistance against stress such as a temperature change, high to low, and its mounting strength capable of withstanding intense vibration.
Ricoh offers a number of small and high heat dissipation packages to support compact and large-current electronic devices in recent years.
Flat lead package is a package excellent in self-alignment property. SOT and SON packages are available.
When mounting a flat lead package on a mounting board, a surface tension of solder at a reflow heating helps the package move to a correct position and bond on the land pattern even if the package is misalignedly mounted to the solder paste.
Due to the miniaturization of applications, adopting small, thin and mount-area-reducible leadless packages such as DFN and PLP packages are increasing.
Ricoh offers a number of ultra-small and thin leadless packages meeting various needs of customers.
There is an increasing demand for leadless package which reduces mounting area due to the miniaturization of applications. However, it is difficult to check the status of the board since the leadless package has solder joints at the lower part of the package.
Especially for automotive and industrial applications requiring high reliability, defects in solder joining may be a serious problem.
Ricoh uses QFN package with wettable flank structure.
Having a solder joint at the tip of each pin allows a visible inspection of wettability and enables maintaining reliability of solder joints.
Package with wettable flank structure is essential for enhancing safety and reliability of automotive and industrial applications.
The RN5T569 enables a wettability of solder joint readily visible by adopting the wettable flank structure.
Normally, DCDC controller's mounting area and a number of components tend to get increased due to the need of an external MOSFET. Using the Multi Chip Module (MCM) package and having multiple ICs into one package enables to integrate ICs.
The one-packaging achieves the reduced number of components and the miniaturization and weight reduction of the mounting board.
DCDC controller and MOSFET are hardly affected by noise since they are optimally connected inside the MCM package. Their electrical characteristics are enhanced comparing to our similar products.
MCM package helps reducing the total cost by decreasing the number of components and enhancing characteristics.
The QFN0505-32B package available in the R1273L is the MCM package with built-in DCDC controller and two MOSFETs.
The advantage of WLCSP (Wafer Level Chip Size Package) is small, thin, and light weight. The size of semiconductor chip equals to the size of package.
Adopting WLCSP contributes to the miniaturization and the weight reduction for mobile devices and IoT devices.