For Consumer / IoT
|Max. temperature||Max. time||Applicable parts|
|350°C||5s||Lead (when hand-soldering is necessary)|
Don’t use halogenous solder flux.
Pb-Free IR Reflow profile
Dip soldering (SOT23, SC82/88 package)
Though heating process may be carried out 3 times, in reflow method, be sure to minimize the temperature and the exposure time.
|Storage time||JEDEC||JEITA||Mainly Package|
|LEVEL||Storage condition||LEVEL||Storage condition|
|Unlimited||1||30°C, 85% RH or less||1||30°C, 85% RH or less||SOT-23, SOT-89, SON/HSON, SC82/SC88, DFN, WLCSP, HSOP, TO-252|
|1 year (*)||2||30°C, 60% RH or less||2-J||30°C, 70% RH or less|
|4 weeks (*)||2a||30°C, 60% RH or less||2a-J||30°C, 70% RH or less||SON-22, SOP-14 (For RTC module)|
|2 weeks (*)||-||-||2b-J||30°C, 70% RH or less|
|168 hours (*)||3||30°C, 60% RH or less||3-J||30°C, 70% RH or less||FBGA, QFP|
|72 hours(*)||4||30°C, 60% RH or less||4-J||30°C, 70% RH or less|
|48 hours (*)||5||30°C, 60% RH or less||5-J||30°C, 70% RH or less|
|24 hours (*)||5a||30°C, 60% RH or less||5a-J||30°C, 70% RH or less|
|Time on label (*)||6||30°C, 60% RH or less||6-J||Time on label (*)|
(*) Baking: 125°C, 10 h
The devices should be handled by the necessary ESD precautions and in the condition of greater than 40%RH relative humidity.
When handling integrated circuits, wear antistatic work cloths in case an open state of pins during measurement and incorporation of integrated circuits may increase the possibilities of electrostatic breakdowns.
At the same time, ensure that the human body is grounded through a 1-megohm resistor placed in its vicinity. Otherwise, electric leakage may subject the human body to electric shocks coming from conductive outfits such as rings and bracelets.
Further, be sure to handle integrated circuits on properly grounded conductive mats and avoid direct contact with pins on integrated circuits. Note that electrification from the human body or clothing amounts to several thousand volts or more.
When unpacking this product, also take care not to suffer injuries from projections and other obstacles.
Be sure to ground measuring instruments to prevent integrated circuits from being impressed with any surge due to electric leakage. Particularly when powering on and off measuring instruments, use a clamping circuit to also prevent integrated circuits from being impressed with any voltage or current exceeding their maximum rating from measuring instruments.
Further, take utmost care to avoid inverse or wrong orientations of integrated circuits and short circuits between pins as well as bending, floating, and deformation of leads.
When transporting integrated circuits and mounted substrates, pack them in conductive containers instead of plastic or styrofoam containers, which allow electrostatic buildup during transportation, leading to breakage’s of integrated circuits. Similarly, when transporting integrated circuits and mounted substrates on a belt conveyer, provide it with appropriate antistatic measures or pack integrated circuits in conductive containers before placing them on the belt conveyer in case its rubber belt may bear electric charges.
Take utmost care to prevent vibrations or shocks from being applied to integrated circuits and mounted substrates.
When powering on and off equipment on which are mounted packages, prevent integrated circuits from being impressed with any voltage or current exceeding their maximum rating.
When integrated circuits are subject to any surge, protect them by means of filters, resistors, and capacitors.
Additionally, the product should not be used in the following environments.
Here are some guidelines when removing components from the board.