For Consumer / IoT
Do Ψjt, θja, and power dissipation vary by the size of the board? How can I predict the power dissipation, the Ψjt, and the θja of the board we have designed?
How can I calculate the power dissipation of an LDO regulator?
What must be taken into account to lay out PCB?
Where is the information on the recommended landing patterns?
What must be taken care of when mounting your ICs?
What do the squared values or characters in the outline drawings of packages mean?
What is junction temperature?
What do the characters on the surface of a package represent?
How should the tab on the bottom surface of DFN (PLP) packages be connected?
What measures are you taking for Pb-free and halogen-free?
What is thermal resistance?